hlmp-cexx t-1 ? (5mm) extra bright cyan leds data sheet features viewing angle: 15, 23 and 30 well de?ned spatial radiation pattern high brightness material superior resistance to moisture package options: C stand-o? and non stand-o? leads untinted and non di?used applications tra?c signals description the high intensity cyan leds are based on the most e?cient and cost e?ective ingan material technol- ogy. the 505nm typical dominant wavelength is most suitable for tra?c signal application. these led lamps are untinted, non-di?used, t-1? packages incorporating second generation optics which produce well-de?ned spatial radiation patterns at speci?c viewing cone angles. these lamps are made with an advanced optical grade epoxy, o?ering superior temperature and moisture resis- tance in outdoor sign and signals applications. package dimensions a: non stand-o? caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. b: stand-o? package dimension a dimension d 15 8.70 0.20 mm 13.00 0.20 mm 23 8.65 0.20 mm 12.25 0.20 mm 30 8.65 0.20 mm 12.05 0.20 mm notes: 1. measured above ?ange. 2. all dimensions in millimeters (inches). 5.00 0.20 0.197 0.008 note 1 dimension a 1.0 0.20 0.039 0.008 0.50 0.20 .020 .008 sq. typ. cathode cathode ?at 25.40 0.901 2.540 0.2 0.100 0.008 5.80 0.20 0.228 0.008 ? 1.00 .039 min min 5.00 0.20 0.197 0.008 note 1 dimension a dimension d 1.0 0.20 0.039 0.008 1.30 0.15 0.051 0.006 0.50 0.20 .020 .008 sq. typ. cathode cathode ?at 25.40 0.901 2.540 0.2 0.100 0.008 5.80 0.20 0.228 0.008 ? 1.00 .039 min min
2 device selection guide part number luminous intensity iv (mcd) at 20 ma min. luminous intensity iv (mcd) at 20 ma max. stand-o? hlmp-ce13-35cdd 27000 59000 no hlmp-ce13-35qdd 27000 59000 no hlmp-ce22-z2cdd 12000 27000 no hlmp-ce22-z2qdd 12000 27000 no HLMP-CE34-Y1CDD 9300 21000 no hlmp-ce34-y1qdd 9300 21000 no hlmp-ce14-35cdd 27000 59000 yes hlmp-ce14-35qdd 27000 59000 yes hlmp-ce25-z2cdd 12000 27000 yes hlmp-ce25-z2qdd 12000 27000 yes hlmp-ce35-y1cdd 9300 21000 yes hlmp-ce35-y1qdd 9300 21000 yes tolerance for each intensity limit is 15%. notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. tolerance for each intensity limit is 15%. 3. please refer to an 5352 for detail information on features of stand-o? and non stand-o? leds. part numbering system packaging option dd: ammopack color bin selection c: color bin 3 & 4 q: color bin 7 & 8 maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide viewing angle and lead stands-o?s 13: 15 without stand-o? 14: 15 with stand-o? 22: 23 without stand-o? 25: 23 with stand-o? 34: 30 without stand-o? 35: 30 with stand-o? hlmp-c e xx C x x x xx note: please refer to ab 5337 for complete information about part numbering system.
3 electrical / optical characteristics t a = 25c parameter symbol min. typ. max. units test conditions forward voltage v f 2.8 3.2 3.5 v i f = 20 ma dominant wavelength [1] d 505 nm i f = 20 ma peak wavelength peak 501 nm peak of wavelength of spectral distribution at i f = 20 ma spectral halfwidth 1/2 30 wavelength width at spectral distri- bution ? power point at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-cathode lead luminous e?cacy [2] v 326 lm/w emitted luminous power/emitted radiant power luminous flux v 2.1 lm i f = 20 ma luminous e?ciency [3] e 34 lm/w emitted luminous flux/electrical power notes: 1. the dominant wavelength is derived from the chromaticity diagr am and represents the color of the lamp. tolerance for each co lor of dominant wavelength is 0.5nm. 2. the radiant intensity, i e in watts per steradian, may be found from the equation i e = i v / v where i v is the luminous intensity in candelas and v is the luminous e?cacy in lumens/watt. 3. e = v / i f x v f where v is the emitted luminous ?ux, i f is electrical forward current and v f is the forward voltage. absolute maximum ratings t j = 25c parameter value unit dc forward current [1] 30 ma peak forward current 100 [2] ma power dissipation 107 mw reverse voltage not recommended for reverse bias operating temperature range -40 to +85 c storage temperature range -40 to +85 c notes: 1. derate linearly as shown in figure 5. 2. duty factor 10%, frequency 1khz.
4 figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current f igure 4. relative dominant wavelength vs forward current figure 5. maximum forward current vs ambient temperature f igure 6. representative spatial radiation pattern C 15 lamps 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 400 450 500 550 600 650 700 wavelength - nm relative intensity 0 5 10 15 20 25 30 01234 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 5 10 15 20 25 30 dc forward current - ma relative luminous intensity (normalized at 20 ma) -4 -2 0 2 4 6 8 10 12 14 16 0 5 10 15 20 25 30 forward current - ma dominant wavelength shift - nm 0 5 10 15 20 25 30 35 0 20 40 60 80 100 ta - ambient temperature - c idc max -max. allowable dc current - ma 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 30 60 90 angular displacement - deg normalized intensity
5 intensity bin limit table (1.3: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max y 9300 12000 z 12000 16000 1 16000 21000 2 21000 27000 3 27000 35000 4 35000 45000 5 45000 59000 tolerance for each bin limit is 15% 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 30 60 90 angular displacement - deg normalized intensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 30 60 90 angular displacement - deg normalized intensity figure 8. representative spatial radiation pattern C 30 lamps figure 7. representative spatial radiation pattern C 23 lamps relative light output vs junction temperature 0.1 1 10 -40 -20 0 20 40 60 80 100 tj - junction temperature - c relative light output (normalized at tj = 25c) cyan color bin limits bin min max 3 500 505 4 505 510 7 498 503 8 503 508 tolerance for each bin limit is 0.5nm.
6 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be e?ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1.59 mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105c max. - preheat time 60 sec max - peak temperature 260c max. 260c max. dwell time 5 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering pro?le to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with di?erent size and design (component density) will have di?erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering pro?le again before loading a new type of pcb. 2. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260c and the solder contact time does not exceeding 5sec. over- stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led con?guration any alignment ?xture that is being applied during wave soldering should be loosely ?tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment ?xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using re?ow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause di?culty inserting the th led.
7 refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. example of wave soldering temperature pro?le for th led ammo packs drawing recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3 sec - 5 sec (maximum = 5 sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 60 sec max time (sec) 260c max 105c max temperature (c) a a 12.701.00 0.500.0394 20.501.00 0.8070.039 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118 0.700.20 0.02760.0079 6.351.30 0.250.0512 4.000.20typ. ? 0.15750.008 view a-a cathode note: all dimensions are in milimeters (inches).
8 packaging box for ammo packs note: the dimension for ammo pack is applicable for the device with stando? and without stando?. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 260c label on this side of box from left side of box adhesive tape must be facing upwards. anode lead leaves the box first.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1823en - january 20, 2010 (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 260c lam p s bab y label (ii) avago baby label (only available on bulk packaging) disclaimer: avagos products and software are not speci?cally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
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